COMPOSITIONS AND METHODS FOR THE REMOVAL OF PHOTORESIST FOR A WAFER REWORK APPLICATION

Compositions useful in reworking microelectronic device wafers, i.e., removing photoresist from rejected wafers, without damaging underlying layers and structures such as cap layers, interlevel dielectric layers, etch stop layers and metal interconnect material. The semi-aqueous compositions include...

Full description

Saved in:
Bibliographic Details
Main Authors VISINTIN PAMELA M, KORZENSKI MICHAEL B
Format Patent
LanguageEnglish
Korean
Published 13.07.2009
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
CANDLES
CHEMISTRY
DETERGENT COMPOSITIONS
DETERGENTS
FATTY ACIDS THEREFROM
METALLURGY
RECOVERY OF GLYCEROL
RESIN SOAPS
SOAP OR SOAP-MAKING
USE OF SINGLE SUBSTANCES AS DETERGENTS
Online AccessGet full text

Cover

More Information
Summary:Compositions useful in reworking microelectronic device wafers, i.e., removing photoresist from rejected wafers, without damaging underlying layers and structures such as cap layers, interlevel dielectric layers, etch stop layers and metal interconnect material. The semi-aqueous compositions include at least one alkali and/or alkaline earth metal basic salt, at least one organic solvent, water, optionally at least one quaternary ammonium basic salt, optionally at least one metal corrosion inhibitor and optionally at least one water-soluble polymer surfactant.
Bibliography:Application Number: KR20097008641