TOP NOZZLE AND SUBSTRATE TREATMENT APPARATUS

A top nozzle and a substrate processing device are provided to improve cleaning efficiency by supplying the cleaning gas to a process chamber uniformly. A process chamber includes a chuck and a top nozzle(140). The chuck is arranged in the process chamber and supports the substrate. The top nozzle i...

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Bibliographic Details
Main Author WON, JUN HO
Format Patent
LanguageEnglish
Korean
Published 01.07.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A top nozzle and a substrate processing device are provided to improve cleaning efficiency by supplying the cleaning gas to a process chamber uniformly. A process chamber includes a chuck and a top nozzle(140). The chuck is arranged in the process chamber and supports the substrate. The top nozzle is arranged in the upper part of the process chamber and supplies the process gas and the cleaning gas to the process chamber. The top nozzle includes a first body(142), a second body(144), and a third body(148). The first body with a tube shape has a process gas path(143). The second body with the tube shape has a cleaning gas path. The third body is extended from the first body downwardly and has the plate with a larger diameter than the first body and the second body.
Bibliography:Application Number: KR20070138633