TOP NOZZLE AND SUBSTRATE TREATMENT APPARATUS
A top nozzle and a substrate processing device are provided to improve cleaning efficiency by supplying the cleaning gas to a process chamber uniformly. A process chamber includes a chuck and a top nozzle(140). The chuck is arranged in the process chamber and supports the substrate. The top nozzle i...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
01.07.2009
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Subjects | |
Online Access | Get full text |
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Summary: | A top nozzle and a substrate processing device are provided to improve cleaning efficiency by supplying the cleaning gas to a process chamber uniformly. A process chamber includes a chuck and a top nozzle(140). The chuck is arranged in the process chamber and supports the substrate. The top nozzle is arranged in the upper part of the process chamber and supplies the process gas and the cleaning gas to the process chamber. The top nozzle includes a first body(142), a second body(144), and a third body(148). The first body with a tube shape has a process gas path(143). The second body with the tube shape has a cleaning gas path. The third body is extended from the first body downwardly and has the plate with a larger diameter than the first body and the second body. |
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Bibliography: | Application Number: KR20070138633 |