TOP NOZZLE AND SUBSTRATE TREATMENT APPARATUS
A top nozzle and a substrate processing apparatus are provided to improve cleaning efficiency by preventing the leakage of the cooling gas of an electrostatic chuck and a particle. A chuck is arranged in a process chamber and supports a substrate. A top nozzle(140) is arranged in the upper part of t...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
01.07.2009
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Subjects | |
Online Access | Get full text |
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