BAKE APPARATUS HAVING A HEATER PLATE AND METHOD FOR MANUFACTURING THE HEATER PLATE

A bake apparatus having a heater plate and a method for manufacturing the heater plate are provided to reduce a critical dimension of a circuit line width by heating a wafer with a high uniform temperature in wafer bake process. A bake apparatus includes a chamber forming an airtight space and a hea...

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Bibliographic Details
Main Authors LIM, HYUNG TAEK, YU, RAE SUNG, HAN, SANG JO, HA, JUNG IK, YOO, HO SUN, KIM, IN GYU, LIM, JAE HOON
Format Patent
LanguageEnglish
Korean
Published 01.07.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A bake apparatus having a heater plate and a method for manufacturing the heater plate are provided to reduce a critical dimension of a circuit line width by heating a wafer with a high uniform temperature in wafer bake process. A bake apparatus includes a chamber forming an airtight space and a heat plate(30) installed inside a chamber. A heat plate is made of a ceramic, and heat plate includes a base plate(31) and a heater which is formed with a metal plating layer at the lower part of the base plate while the heater is formed by electroless plating. The heater is formed into the predetermined pattern by photolithography process.
Bibliography:Application Number: KR20070137767