SOLDER, AND METHOD FORMING SOLDER BUMP USING SOLDER
A solder and a method for forming a solder bump in a electrode pad of wifer using the solder are provided not to change the template to high temperature even if a material for solder bump is filled in the cavities of template. A solder comprises minute powder of metal and mixture. The minute powder...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
29.06.2009
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A solder and a method for forming a solder bump in a electrode pad of wifer using the solder are provided not to change the template to high temperature even if a material for solder bump is filled in the cavities of template. A solder comprises minute powder of metal and mixture. The minute powder of metal is an ingredient for solder bump. The mixture is mixed with organic solvent. The material for solder bump is a gold(Au) or silver and tin ally(Ag/Sn). |
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| AbstractList | A solder and a method for forming a solder bump in a electrode pad of wifer using the solder are provided not to change the template to high temperature even if a material for solder bump is filled in the cavities of template. A solder comprises minute powder of metal and mixture. The minute powder of metal is an ingredient for solder bump. The mixture is mixed with organic solvent. The material for solder bump is a gold(Au) or silver and tin ally(Ag/Sn). |
| Author | RHEE, HO DUCK CHOI, EUN YOUL CHA, JUNG HAG LIM, YONG JIN |
| Author_xml | – fullname: RHEE, HO DUCK – fullname: CHA, JUNG HAG – fullname: CHOI, EUN YOUL – fullname: LIM, YONG JIN |
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| Snippet | A solder and a method for forming a solder bump in a electrode pad of wifer using the solder are provided not to change the template to high temperature even... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SOLDER, AND METHOD FORMING SOLDER BUMP USING SOLDER |
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