SOLDER, AND METHOD FORMING SOLDER BUMP USING SOLDER

A solder and a method for forming a solder bump in a electrode pad of wifer using the solder are provided not to change the template to high temperature even if a material for solder bump is filled in the cavities of template. A solder comprises minute powder of metal and mixture. The minute powder...

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Bibliographic Details
Main Authors RHEE, HO DUCK, CHA, JUNG HAG, CHOI, EUN YOUL, LIM, YONG JIN
Format Patent
LanguageEnglish
Published 29.06.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A solder and a method for forming a solder bump in a electrode pad of wifer using the solder are provided not to change the template to high temperature even if a material for solder bump is filled in the cavities of template. A solder comprises minute powder of metal and mixture. The minute powder of metal is an ingredient for solder bump. The mixture is mixed with organic solvent. The material for solder bump is a gold(Au) or silver and tin ally(Ag/Sn).
Bibliography:Application Number: KR20070136884