EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

An epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same are provided to improve adhesive property of various elements, such as semiconductor chip and lead frame, and crack resistance. An epoxy resin composition for encapsulating semiconductor device...

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Bibliographic Details
Main Authors NA, WOO CHUL, PARK, HYUN JIN, KIM, JO GYUN
Format Patent
LanguageEnglish
Published 29.06.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same are provided to improve adhesive property of various elements, such as semiconductor chip and lead frame, and crack resistance. An epoxy resin composition for encapsulating semiconductor device comprises: an epoxy resin, hardener, hardening promoter, 0.01-2 wieght% of thioester based compound of the chemical formula 1 as an adhesive improver, and inorganic filler. The epoxy resin comprises phenol aralkyl epoxy resin of the chemical formula 2 or biphenyl epoxy resin of the chemical formula 3. In the chemical formuls 2, the mean of n is 1-7. In the chemical formula 3, the mean of n is 0-7.
Bibliography:Application Number: KR20070136050