FLIP CHIP BGA HAVING DISSYMMETRY SIDE AND MANUFACTURING METHOD THEREOF

A FCB(Flip Chip Ball grid array) substrate having dissymmetry side and a manufacturing method thereof are provided to improve a signal delivery speed by forming metal layers and interlayer insulation films of different number in a top part and a bottom part of a substrate. A plating layer(110) and a...

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Bibliographic Details
Main Author KIM, NAM YEOL
Format Patent
LanguageEnglish
Published 16.06.2009
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A FCB(Flip Chip Ball grid array) substrate having dissymmetry side and a manufacturing method thereof are provided to improve a signal delivery speed by forming metal layers and interlayer insulation films of different number in a top part and a bottom part of a substrate. A plating layer(110) and a metal layer(112) are formed in both sides of a substrate(100). A plurality of plugs(120) is formed in a center of the substrate. A plurality of top interlayer insulation films(130a,150a) is formed on a top part of the substrate. A plurality of top metal layers(140a,160a) is formed on a top part of a plurality of top interlayer insulation films. A plurality of bottom interlayer insulation films(150b) is formed on a bottom part of the substrate. The number of the bottom interlayer insulation films is different from the number of top interlayer insulation films. A plurality of bottom metal layers(160b) is formed on a bottom part of a plurality of bottom interlayer insulation films. A solder resist(170) is formed on an outermost top metal layer and bottom metal layer.
Bibliography:Application Number: KR20070128531