SIMULTANEOUS DOUBLE-SIDE GRINDING OF SEMICONDUCTOR WAFERS

A method and a device for correcting grinding spindles in a double-sided grinding device of a semiconductor wafer are provided to measure the alignment of an axial direction accurately in a grinding position of a DDG(Double Disk Grinding) by improving the orientation of the grinding spindles. Two sp...

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Bibliographic Details
Main Authors WEISS ROBERT, JUNGE JOACHIM
Format Patent
LanguageEnglish
Published 22.04.2009
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A method and a device for correcting grinding spindles in a double-sided grinding device of a semiconductor wafer are provided to measure the alignment of an axial direction accurately in a grinding position of a DDG(Double Disk Grinding) by improving the orientation of the grinding spindles. Two spindles are combined with a bonding element(6). A spindle advance shaft or a grinding disk flange is accurately moved to a working position. A measuring device includes a sensor(5) for sensing a distance in an axial direction and the sensor(4) for sensing the distance in a radial direction. An angle meter(3) measures the azimuthal position in the direction of 3, 6, 9, and 12 o'clock. The angle meter, the sensors, and half one of the bonding element are fixed in a right storage plate.
Bibliography:Application Number: KR20080090996