OPTICAL MODULE HAVING MAGNETIC ALIGN MARK FOR PASSIVE ALIGNMENT AND FABRICATION METHOD THEREOF
An optical module having a magnetic align mark for passive alignment is provided to improve productivity by simplifying a bonding of an optical device and a substrate. An alignment mark of substrate(12) is formed in the single-side(10a) of the substrate(10) for the flip chip bonding. A device alignm...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
24.03.2009
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | An optical module having a magnetic align mark for passive alignment is provided to improve productivity by simplifying a bonding of an optical device and a substrate. An alignment mark of substrate(12) is formed in the single-side(10a) of the substrate(10) for the flip chip bonding. A device alignment mark(22) is formed in a counter surface(20a) of an optical device for a flip chip bonding which the single-side of substrate corresponds to each other. A magnet alignment mark made of material having one among the alignment mark of substrate and device alignment mark is formed, and the other one made of the metal alignment mark among the alignment mark of substrate and device alignment mark is formed. The material having magnetism is formed with the supermalloy of Ni80 Fe14 Mo5. The alignment mark of substrate and device alignment mark are formed by using a sputtering method, a plating method, and an electron-beam evaporation method. |
---|---|
Bibliography: | Application Number: KR20070095442 |