WET LAMINATION OF PHOTOPOLYMERIZABLE DRY FILMS ONTO SUBSTRATES AND COMPOSITIONS RELATING THERETO

A wet lamination system of photopolymerizable dry films is provided to improve the performance for undesirable air permeability and undesirable surface residue. A wet lamination system of photopolymerizable comprises (a) dry film photoresist, (b) laminate containing copper, stainless steel and non-m...

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Bibliographic Details
Main Authors JORGE PEDRO GONCALO CARVALHAIS TEIXEIRA DIAS, YU SHINJI
Format Patent
LanguageEnglish
Published 04.03.2009
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CINEMATOGRAPHY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
TRANSPORTING
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Summary:A wet lamination system of photopolymerizable dry films is provided to improve the performance for undesirable air permeability and undesirable surface residue. A wet lamination system of photopolymerizable comprises (a) dry film photoresist, (b) laminate containing copper, stainless steel and non-metal on the surface, (c) lamination fluid and (d) fluid coater on the laminate. The lamination fluid comprises water, cosolvent and surface energy modifier. The cosolvent is alcohol, ketone, hydrocarbon or their mixture and is contained in an amount of 0.1-20 weight % based on the superposed fluid.
Bibliography:Application Number: KR20080083847