PACKAGING OF MEMS DEVICES

The present invention is directed to a process for packaging a microelectrical, micromechanical, microelectromechanical (MEMS) or microfluidic component on a substrate by forming cavities made from crosslinked photoresists on an easily removable second substrate, bonding the cavities to third substr...

Full description

Saved in:
Bibliographic Details
Main Authors JOHNSON DONALD W, NAGALE MILIND P
Format Patent
LanguageEnglish
Published 06.02.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:The present invention is directed to a process for packaging a microelectrical, micromechanical, microelectromechanical (MEMS) or microfluidic component on a substrate by forming cavities made from crosslinked photoresists on an easily removable second substrate, bonding the cavities to third substrates containing selected microdevices, then peeling off the removable second substrate.
Bibliography:Application Number: KR20087022444