SEALING RESIN COMPOSITION AND LCD

A sealing resin composition is provided to minimize the epoxy elution in procuring at 80~100 deg.C not to generate the liquid crystal contamination, and to ensure excellent adhesive force by absorbing the stress from the outside. A sealing resin composition comprises an epoxy resin, a potential ther...

Full description

Saved in:
Bibliographic Details
Main Authors OH, BYOUNG HO, JEONG, YONG MAN, LEE, JIN KOO
Format Patent
LanguageEnglish
Published 28.11.2008
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online AccessGet full text

Cover

More Information
Summary:A sealing resin composition is provided to minimize the epoxy elution in procuring at 80~100 deg.C not to generate the liquid crystal contamination, and to ensure excellent adhesive force by absorbing the stress from the outside. A sealing resin composition comprises an epoxy resin, a potential thermosetting material, and non-crosslinked acryl-based polymer microparticles and acryl-based polymer microparticles having a core cell structure. The non-crosslinked acryl-based polymer microparticles have a softening point of 130 deg.C and an average particle diameter of 0.01-3 micrometer.
Bibliography:Application Number: KR20070050626