ADHESIVE COMPOSITION

An adhesive composition is provided to obtain enough connection reliablility and adhesive property even in case that the width and space of electrodes of the connected circuit are very narrow and to suppress the degradation of adhesive property and connection reliablility even under high temperature...

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Bibliographic Details
Main Authors KATAYAMA EMI, SUGIURA MINORU
Format Patent
LanguageEnglish
Published 27.11.2008
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:An adhesive composition is provided to obtain enough connection reliablility and adhesive property even in case that the width and space of electrodes of the connected circuit are very narrow and to suppress the degradation of adhesive property and connection reliablility even under high temperature and high humidity environment. An adhesive composition comprises (A) a urethane resin containing a (math)acrylate group in a side chain and having the average molecular weight of 10,000-500,000; and (B) a hardener generating glass radical by optical irradiation or heating. The urethane resin(A) comprises a copolymer represented by the following chemical formula I. In the formula I, X shows a diisocyanate residue; Y shows the diol residue; and n shows an integer of 1-100.
Bibliography:Application Number: KR20080048080