WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

A wiring board and a method for manufacturing the same are provided to expose pads for mounting semiconductor chips with high precision in response to miniaturization and precision enhancement of the semiconductor chips. A wiring board includes an uppermost wiring layer(4) and an insulation resin la...

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Bibliographic Details
Main Authors KUSAMA YASUHIKO, MURAMATSU SHIGETSUGU
Format Patent
LanguageEnglish
Published 04.06.2008
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A wiring board and a method for manufacturing the same are provided to expose pads for mounting semiconductor chips with high precision in response to miniaturization and precision enhancement of the semiconductor chips. A wiring board includes an uppermost wiring layer(4) and an insulation resin layer(5). The uppermost wiring layer is formed on an uppermost insulation layer(3). The insulation layer covers the uppermost wiring layer. A part of the uppermost wiring layer is thicker than the other part of the uppermost wiring layer. An uppermost wiring has a pad(6) exposed from a surface of the insulation resin layer for connection with a surface-mounted component such as a semiconductor chip to be mounted on the wiring board.
Bibliography:Application Number: KR20070118269