LEAD FRAME, METHOD OF MANUFACTURING A FACE-DOWN TERMINAL SOLID ELECTROLYTIC CAPACITOR USING THE LEAD FRAME, AND FACE-DOWN TERMINAL SOLID ELECTROLYTIC CAPACITOR MANUFACTURED BY THE METHOD

• Main Author: ISHIJIMA MASAMI
• Format: Patent
• Language: English
• Published: 13.05.2008
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY

A lead frame, a method of manufacturing a face-down terminal solid electrolytic capacitor using lead frame, and a face-down terminal solid electrolytic capacitor manufactured by the same are provided to reduce a distance of a current path between an anode and a cathode. A lead frame(100) used for manufacturing a face-down terminal solid electrolytic capacitor includes a frame body(110), an anode terminal formation part(21), and a cathode terminal formation part(22). The frame body extends in a first direction(A1). The anode terminal formation part is connected to the frame body to form an anode terminal. The cathode terminal formation part is connected to the frame body to form a cathode terminal. The anode terminal formation part and the cathode terminal formation part are spaced from each other on a main surface(112) of the frame body in the first direction. The frame body includes a connection unit(111) to be connected to a capacitor element(11). The connection unit extends to a position adjacent to the anode terminal formation part from the cathode terminal formation part in the first direction.