SPUTTERING APPARATUS

A sputtering apparatus is provided to simplify a sputtering process by cleaning a chamber at a vacuum condition, when a target material is re-deposited on an upper portion of a target. A vacuum condition is maintained in a chamber(300). An air ejection hole(213) is arranged on one side of the chambe...

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Bibliographic Details
Main Authors KIM, KANG SUK, AHN, YU KYEONG
Format Patent
LanguageEnglish
Published 02.05.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A sputtering apparatus is provided to simplify a sputtering process by cleaning a chamber at a vacuum condition, when a target material is re-deposited on an upper portion of a target. A vacuum condition is maintained in a chamber(300). An air ejection hole(213) is arranged on one side of the chamber and maintains the vacuum condition in the chamber. A first gas injection hole(211) is arranged on one side of the chamber and injects inertia gas into the chamber. A substrate transfer unit(209) is arranged in the chamber and transfers a substrate. A backing plate(203) is arranged in the chamber and calibrates a target, which is a thin film material deposited on the substrate. A cathode plate(205) is arranged at a rear surface of the backing plate. A DC voltage is applied on the cathode plate. A second gas injection hole(231) injects cleaning gas into the chamber, such that the target is cleaned.
Bibliography:Application Number: KR20060104833