ADHERING APPARATUS OF POLISHING PAD

An apparatus of attaching a polishing pad is provided to install a table contact body, a support for the table contact body and a pad supporting member on which the polishing pad is mounted such that the attachment precision of the polishing pad is improved. An apparatus(200) of attaching a polishin...

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Bibliographic Details
Main Authors MIN, CHUNG KI, WOO, CHANG YEON, KIM, YUNG JUN, LEE, HYO JIN, YOON, BYOUNG MOON, PARK, JOON SANG
Format Patent
LanguageEnglish
Published 28.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:An apparatus of attaching a polishing pad is provided to install a table contact body, a support for the table contact body and a pad supporting member on which the polishing pad is mounted such that the attachment precision of the polishing pad is improved. An apparatus(200) of attaching a polishing pad comprises a table contact body(210), a plurality of supports(220) for supporting the table contact body and a pad supporting member(230). The table contact member makes contact with a side of a rotation table(130). The support is provided on the table contact body such that the support vertically moves with respect to the table contact body. The pad supporting member is detachably installed on the table contact body. A polishing pad is mounted on the pad supporting member.
Bibliography:Application Number: KR20060103092