SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

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Bibliographic Details
Main Authors ESTACIO MARIA CRISTINA B, GOOI BOON HUAN, LIM LAY YEAP, KENG TAN TEIK, JEON, O SEOB, LEE, BUYONG OK, NAM, SHI BAEK, WU CHUNG LIN, CHONG DAVID, JOSHI RAJEEV, CHOI, YOON HWA, IYER VENKAT
Format Patent
LanguageEnglish
Published 08.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
Bibliography:Application Number: KR20077030001