APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PIPE CONNECTION JIG USED THE SAME

• Main Authors: YUN, JOON HEE, CHOI, KWAN MOOK
• Format: Patent
• Language: English
• Published: 10.03.2008
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; JOINTS OR FITTINGS FOR PIPES; LIGHTING; MEANS FOR THERMAL INSULATION IN GENERAL; MECHANICAL ENGINEERING; PIPES; SEMICONDUCTOR DEVICES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; THERMAL INSULATION IN GENERAL; WEAPONS

A semiconductor manufacturing apparatus and a pipe connection jig installed therein are provided to increase or maximize productivity by using a distributive tube connection jig for identifying a fastening degree of distributive tube connection units. A reaction chamber(110) includes a space sealed from an outside in order to perform a semiconductor manufacturing process. A source(120) is formed to supply one or more kinds of gas or fluid in the semiconductor manufacturing process. A distributive tube(130) is formed between the source and the reaction chamber in order to move the gas or the fluid. A distributive tube connection unit(140) is formed to form a cut part of the distributive tube. A distributive tube connection jig(150) is coupled with an outer circumference of the distributive tube connection unit in order to guide a fastening degree of the distributive tube connection unit.