UBM PAD, SOLDER CONTACT AND METHODS FOR CREATING A SOLDER JOINT

The invention relates to a UBM pad (91) for a soldered contact comprising a first material layer (93), made from a first material and a second material layer (95), made from a second material and itself representing a terminal layer or which is arranged between a terminal layer and the first materia...

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Bibliographic Details
Main Authors ENGELMANN GUNTER, REICHL HERBERT, JURENKA CLAUDIA, WOLF JUERGEN
Format Patent
LanguageEnglish
Published 23.01.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a UBM pad (91) for a soldered contact comprising a first material layer (93), made from a first material and a second material layer (95), made from a second material and itself representing a terminal layer or which is arranged between a terminal layer and the first material layer (93). The first material and the second material have properties with regard to a solder material (25) such that the presence of the second material (95) prevents metallurgical reactions of the first material (93) with the solder material (25) over the whole temperature range of the connection and the operation of the assembled electronic component which are detrimental to the operation of the whole connection.
Bibliography:Application Number: KR20077027168