A PLASTIC FILM-CONDUCTIVE METAL FOIL LAMINATE AND A METHOD FOR PRODUCING THE SAME

A plastic film-conductive foil laminate and a method for producing the same are provided to have heat resistance and size stability and have a low contamination degree of a surface of a film conductive foil. A method for producing a plastic film-conductive foil laminate(10) includes the steps of: pr...

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Bibliographic Details
Main Author SHIMOSE MAKOTO
Format Patent
LanguageEnglish
Published 10.01.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A plastic film-conductive foil laminate and a method for producing the same are provided to have heat resistance and size stability and have a low contamination degree of a surface of a film conductive foil. A method for producing a plastic film-conductive foil laminate(10) includes the steps of: preparing a preliminary connecting body; rolling the preliminary connecting body with a metal film(12) in a roll shape; and curing an uncured adhesive(4) by heating the roll. The preliminary connecting body is composed of a plastic film(3) and a conductive metal foil(6) preliminarily adhered to a surface of the plastic film by an uncured adhesive layer. The preliminary connecting body includes a device hole closed by the conductive metal foil by penetrating the plastic film and the uncured adhesive layer. The plastic film is a polyimide film. The conductive metal foil is a copper foil.
Bibliography:Application Number: KR20070059066