BONDING APPARATUS AND BONDING SYSTEM PROVIDED WITH SAME

A bonding apparatus and a bonding system are provided with a first holding member for sucking and holding a chip at a lower end of a temporarily press-bonding head, and a second holding member for sucking and holding an FPC. The first holding member sucks and holds the entire surface or a part of a...

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Bibliographic Details
Main Authors KINOSHITA YOSHIHIRO, TAMURA YASUSHI, NARABA SATORU, MATSUDA SEIJI
Format Patent
LanguageEnglish
Published 09.01.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A bonding apparatus and a bonding system are provided with a first holding member for sucking and holding a chip at a lower end of a temporarily press-bonding head, and a second holding member for sucking and holding an FPC. The first holding member sucks and holds the entire surface or a part of a chip component, and the second holding member covers the entire surface of the FPC and sucks and holds at least corner sections. In the bonding system, the chip or/and FPC are sucked and held by operating at least either the first or the second holding member by permitting a control section to switch an electromagnetic valve, corresponding to a transferred mounting member.
Bibliography:Application Number: KR20077021112