METHOD AND DEVICE FOR THERMALLY TREATING SUBSTRATES

The invention relates to a device for thermally treating substrates, wherein the substrates are maintained in contact with or are narrowly distanced from a heating plate which is heated via a plurality of separately controllable heating elements on the side of the heating plate facing away from the...

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Bibliographic Details
Main Authors KRAUSS CHRISTIAN, SAULE WERNER, WEIHING ROBERT, BERGER LOTHAR
Format Patent
LanguageEnglish
Published 27.08.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a device for thermally treating substrates, wherein the substrates are maintained in contact with or are narrowly distanced from a heating plate which is heated via a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate. The heating plate is surrounded at least on the plane thereof by a frame which is distanced therefrom and gas is guided in a controlled manner through a gap between the frame and at least one edge of the heating plate.
Bibliography:Application Number: KR20067017693