ASSEMBLY FOR LOADING WAFER AT THE CHEMICAL MECHANICAL POLISHING EQUIPMENT

• Main Author: KIM, TAE BONG
• Format: Patent
• Language: English
• Published: 24.08.2007
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

A loading cup assembly for loading a wafer on chemical mechanical polishing equipment is provided to prevent breakage of a head caused as a head cup or a base does not normally reach the highest/lowest point. A loading cup assembly(148) for loading a wafer on chemical mechanical polishing equipment includes a base(210), a head cup(220), a plurality of driving shafts, a plurality of power generating units, a plurality of position sensors, and a controller(240). The base has a surface on which a wafer(122) is loaded. The head cup is arranged to surround the base and the wafer. The driving shafts pass through the head cup, and move the cup and the base in a vertical direction underneath the center of the base. The power generating units move the driving shafts in the vertical direction. The position sensors are arranged in the vicinity of the power generating units, and sense the vertical movement of the driving shafts. The controller judges position of the driving shafts by using the signals output from the position sensors, and generates an interlock control signal for stopping the vertical movement of the driving shafts if the base and the head cup have failed in reaching a highest or lowest point at a predetermined point of time.