PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A PANEL USING THE SAME

• Main Authors: LEE, CHANG IK, LEE, HI KUK, OH, SAE TAE, KANG, DOEK MAN, PARK, JEONG MIN, JUNG, DOO HEE
• Format: Patent
• Language: English
• Published: 14.08.2007
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

A photoresist resin composition is provided to decrease contamination on a lower film as being easily stripped by a releasing agent, and reduce undercut of a lower film owing to an improved adhesiveness with the lower film. A photoresist resin composition comprises an alkali-soluble resin, a photo-sensitizer, a cross-linker, and an amine-containing cyclic compound. The amine-containing cyclic compound has a structure represented by the formula(I), wherein R1 and R3 are aliphatic or aromatic ring compounds which are identical to or different from each other, R2 is a C1-5 alkyl group, at least one of R4 to R11 is an amine group(NH2), each remainder except the amine group of R4 to R11 is any one selected from a hydroxyl group, a hydrogen, a methyl group, and an ethyl group.