PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A PANEL USING THE SAME

A photoresist resin composition is provided to decrease contamination on a lower film as being easily stripped by a releasing agent, and reduce undercut of a lower film owing to an improved adhesiveness with the lower film. A photoresist resin composition comprises an alkali-soluble resin, a photo-s...

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Bibliographic Details
Main Authors LEE, CHANG IK, LEE, HI KUK, OH, SAE TAE, KANG, DOEK MAN, PARK, JEONG MIN, JUNG, DOO HEE
Format Patent
LanguageEnglish
Published 14.08.2007
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:A photoresist resin composition is provided to decrease contamination on a lower film as being easily stripped by a releasing agent, and reduce undercut of a lower film owing to an improved adhesiveness with the lower film. A photoresist resin composition comprises an alkali-soluble resin, a photo-sensitizer, a cross-linker, and an amine-containing cyclic compound. The amine-containing cyclic compound has a structure represented by the formula(I), wherein R1 and R3 are aliphatic or aromatic ring compounds which are identical to or different from each other, R2 is a C1-5 alkyl group, at least one of R4 to R11 is an amine group(NH2), each remainder except the amine group of R4 to R11 is any one selected from a hydroxyl group, a hydrogen, a methyl group, and an ethyl group.
Bibliography:Application Number: KR20060012461