INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING

A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).

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Bibliographic Details
Main Authors DODD SIMON, BRYANT FRANK R, MCMAHON TERRY E, HINDMAN GREGORY T, WANG S. JONATHAN, MILLER RICHARD TODD, TOM DENNIS W
Format Patent
LanguageEnglish
Published 11.06.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).
Bibliography:Application Number: KR20077009433