STACKED SEMICONDUCTOR DEVICE AND LOWER MODULE OF STACKED SEMICONDUCTOR DEVICE

A lower module of a stacked semiconductor device includes a first substrate and a first semiconductor chip held above the first substrate. The top surface of the first substrate is provided with a plurality of first chip connection terminals electrically connected to the first chip terminals, respec...

Full description

Saved in:
Bibliographic Details
Main Authors KAWABATA TAKESHI, ITOU FUMITO
Format Patent
LanguageEnglish
Published 02.05.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A lower module of a stacked semiconductor device includes a first substrate and a first semiconductor chip held above the first substrate. The top surface of the first substrate is provided with a plurality of first chip connection terminals electrically connected to the first chip terminals, respectively, and a plurality of upper module connection terminals electrically connectable to an upper module provided with a second semiconductor chip. The back surface of the first substrate is provided with a plurality of external substrate connection terminals. Each of the first chip connection terminals is electrically connected to a corresponding one of the external substrate connection terminals, and each of the upper module connection terminals is electrically connected between a corresponding one of the chip connection terminals and a corresponding one of the external substrate connection terminals.
Bibliography:Application Number: KR20060075540