SEMICONDUCTOR WAFER EDGE TESTING APPARATUS AND WAFER EDGE TESTING METHOD

A semiconductor wafer edge inspecting apparatus and a wafer edge inspecting method are provided to control properly an additional strip process on a wafer edge region by using an image pickup unit and a control unit. A semiconductor wafer edge inspecting apparatus includes a spin chuck for loading s...

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Bibliographic Details
Main Author KIM, HOON HO
Format Patent
LanguageEnglish
Published 03.01.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:A semiconductor wafer edge inspecting apparatus and a wafer edge inspecting method are provided to control properly an additional strip process on a wafer edge region by using an image pickup unit and a control unit. A semiconductor wafer edge inspecting apparatus includes a spin chuck for loading stably a wafer, an image pickup unit and a control unit. The image pickup unit(300) is spaced apart from the spin chuck in order to obtain a variety of images from an edge region of the wafer. The control unit(400) is electrically connected with the image pickup unit. The control unit is used for controlling an additional strip process on the edge region of the wafer.
Bibliography:Application Number: KR20050056595