AUTOMATIC REFERENCE POSITION TEACHING METHOD, AUTOMATIC POSITIONING METHOD, AND AUTOMATIC CARRYING METHOD FOR DISK-LIKE OBJECT, AUTOMATIC REFERENCE POSITION TEACHING DEVICE, AUTOMATIC POSITIONING DEVICE, AND AUTOMATIC CARRYING DEVICE FOR DISK-LIKE OBJECT USING THESE METHODS, AND AUTOMATIC SEMICONDUCTOR MANUFACTURING EQUIPMENT

An automatic reference position teaching method for disk-like object capable of increasing a productivity by automating reference position teachings at ports and a positioning in a stationary production process when equipment is started in a semiconductor manufacturing equipment having a positioning...

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Bibliographic Details
Main Authors NAGAO TETSUYA, IKEDA TOSHIYUKI, SAKIYA FUMIO, SATO YASUHISA
Format Patent
LanguageEnglish
Published 07.12.2006
Subjects
BASIC ELECTRIC ELEMENTS
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
MANIPULATORS
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:An automatic reference position teaching method for disk-like object capable of increasing a productivity by automating reference position teachings at ports and a positioning in a stationary production process when equipment is started in a semiconductor manufacturing equipment having a positioning device and a carrying robot, comprising the steps of detecting two points W1 and W2 where the circumference of a disk-like object (47) such as a wafer crosses the locus (43) of a detection means, and calculating the center position A of the disk-like object by using these two points, a specific point O on the vertical bisector (42) of a line segment connecting these two points, and the radius r of the disk-like object, whereby positioning operation can be performed by the carrying robot, and not only the correction of a carrying route but also the reference position teaching at the time of starting of the equipment can be automated by using the results of the positioning operation. When a cutout part is present in the disk-like object, the circumference of the disk-like object is detected by two loci of the detection means to find out a correct center position, and the circumference of the disk-like object with an unknown radius is detected by three loci of the detection means to obtain the radius so as to allow a mixed production using wafers with different diameters.
Bibliography:Application Number: KR20067023491