DEPOSITION AND PATTERNING PROCESS
A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an interme...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
23.05.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. |
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Bibliography: | Application Number: KR20067000517 |