DEPOSITION AND PATTERNING PROCESS

A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an interme...

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Bibliographic Details
Main Authors MARCZI MICHAEL, EBERLEIN DIETMAR C, SINGH BAWA, DETIG ROBERT H, REILLY KENNETH, LEWIS BRIAN G, MINOGUE GERARD
Format Patent
LanguageEnglish
Published 23.05.2006
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Summary:A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.
Bibliography:Application Number: KR20067000517