RESIN COMPOSITION AND ITS USE

A thermosetting resin composition containing a cyanate ester resin (a) having at least two cyanate groups per molecule, a bismaleimide (b) represented by the formula (1) wherein each of R1, R2, R3, and R4 is independently an alkyl group having 3 or less carbon atoms, and a bismaleimide (c) represent...

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Bibliographic Details
Main Author NOZAKI MITSURU
Format Patent
LanguageEnglish
Published 19.05.2006
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:A thermosetting resin composition containing a cyanate ester resin (a) having at least two cyanate groups per molecule, a bismaleimide (b) represented by the formula (1) wherein each of R1, R2, R3, and R4 is independently an alkyl group having 3 or less carbon atoms, and a bismaleimide (c) represented by the formula (2), a copper-clad laminate comprising the above thermosetting resin composition and a printed wiring board comprising the above copper-clad laminate.
Bibliography:Application Number: KR20050101803