MOUNTING DEVICE FOR ELECTRONIC PARTS

• Main Authors: NAGATA TAKAHIRO, FUKUSHIMA YOSHIHARU, SETO KATSUYUKI
• Format: Patent
• Language: English; Korean
• Published: 12.05.2006
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle (15) and is applicable to electronic components (D) ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle (15) for picking an electronic component (D) up from a plurality of component feeding units supplying the electronic component (D) to a component pickup position and mounting the electronic component (D) on a printed board, where a mounting head (16) movable along a beam can move vertically by a head vertical movement device (33) and the suction nozzle (15) provided on the mounting head (16) can move vertically by a nozzle vertical movement device (50).