METHOD FOR SUPPLYING SOLDER

• Main Authors: OHASHI YUJI, FURUNO MASAHIKO, ANDOU HARUHIKO, ONOZAKI JUNICHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO
• Format: Patent
• Language: English
• Published: 23.06.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method for supplying solder being used for forming pad electrodes at a finer pitch and for obtaining bumps having a sufficient quantity of solder while suppressing variation. At first, a substrate (20) is placed in a liquid tank (11) filled with an inert liquid (13) while directing the surface (21) upward. Inert liquid (13) containing fine solder particles (14) is then fed from a fine particle forming unit (15) to the liquid tank (11) and the fine solder particles (14) are dropped onto the substrate (20) in the inert liquid (13) from a supply pipe (16). The fine solder particles (14) fall naturally by gravitation and reach onto the substrate (20). The fine solder particles (14) reached onto the pad electrode of the substrate (20) stay thereat gravitationally and spread on the surface of the pad electrode after elapsing of a solder wet time thus forming a solder film.