HIGH FLOW RATE BUBBLER SYSTEM AND METHOD

• Main Author: TORKAMAN, AMIR
• Format: Patent
• Language: English
• Published: 12.05.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR RELEVANT APPARATUS; TRANSPORTING

A high flow rate bubbler system and method are provided for producing a stable, easily controllable source of chemical vapors to a downstream process. The bubbler system is equipped with a vaporizer unit connected to its gas outlet tube. This vaporizer unit slows the gas velocity to enhance settling of entrained droplets and contacts the exiting gas with a high thermal mass, heated surfaces to promote heat transfer and evaporation of the entrained droplets.