METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: MAKI, HIROMI, SUGA, HIDEYUKI
• Format: Patent
• Language: English
• Published: 23.03.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for fabricating a semiconductor device is provided to quickly separate a semiconductor chip from adhesive tape without generating a crack or a defect after a semiconductor wafer is diced into a plurality of semiconductor chips. After adhesive tape is attached to a back surface of a semiconductor wafer having an integrated circuit on its main surface, the semiconductor wafer is diced into a plurality of semiconductor chips(1). While an absorption collet(105) absorbs and maintains the upper surface of a semiconductor chip to be separated from the plurality of semiconductor chips attached to the adhesive tape, an upward load is applied to the adhesive tape under the semiconductor chip to be separated by the following processes. The first pushing-up block has the first top surface and an angular part near the first top surface. The second pushing-up block includes the second top surface disposed in the first top surface and an angular part near the second top surface. The first and second top surfaces collide with the back surface of the adhesive tape simultaneously to push up the adhesive tape. The second top surface is pushed up to a position higher than the first top surface so that the adhesive tape is pushed up further.