METHOD FOR FABRICATING SOFT MOLD FOR FORMATION OF MICROPATTERN IN ELECTRONIC CIRCUIT AND SOFT MOLD SYSTEM INCLUDING THE SOFT MOLD
PURPOSE: Provided are a soft mold having magnetic control device used in soft lithography and soft molding for forming micropattern in electronic circuit, especially, for the soft mold sufficient to adapt in mass-production, and automated soft mold system including the same. CONSTITUTION: The method...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
10.03.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: Provided are a soft mold having magnetic control device used in soft lithography and soft molding for forming micropattern in electronic circuit, especially, for the soft mold sufficient to adapt in mass-production, and automated soft mold system including the same. CONSTITUTION: The method comprises steps of forming a master with any pattern; pouring first elastomer on top of the master(A) to form pre-polymer; curing the pre-polymer layer(104) in first curing process; forming magnetized material on top portion of the cured pre-polymer; pouring second elastomer on top of the pre-polymer layer containing the magnetized material then completely curing the pre-polymer layer in second curing process; and releasing the completely cured polymer layer including the magnetized material. The produced soft mold has unevenness on one side and the magnetized material parallel to the unevenness side. |
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Bibliography: | Application Number: KR20030061010 |