RESIN COMPOSITION WITH LOW DIELECTRIC CONSTANT AND DIELECTRIC LOSS TANGENT, PREPREG FOR LAMINATE USING THE SAME, AND METAL-CLAD LAMINATE USING THE PREPREG

• Main Authors: ISHII KENJI, KONDO YOSHINORI, NAWATA MICHIO, NORISUE YASUMASA, NOZAKI MITSURU, OHNO DAISUKE, SHIKA SEIJI
• Format: Patent
• Language: English; Korean
• Published: 09.03.2005
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

PURPOSE: Provided are a resin composition having low dielectric constant and a dielectric loss tangent without damage of forming property and thermal-resistance, and a metal-clad laminate suitable to recent use tendency using high frequency. CONSTITUTION: The resin composition for laminate comprises at least 100wt.% of vinyl compound of formula(1) (wherein R1,R2,R3,R4,R5,R6 and R7 each are same or different, hydrogen, halogen atom, alkyl, halogenated alkyl or phenyl group, -(O-X-O)- is represented by formula(2) or (3), or at least two moieties of formula(2) and/or (3); -(Y-O)- is represented by formula(4) or at least two moieties of the formula(4); Z is organic group having at least one carbon atom containing oxygen, nitrogen, sulfur or halogen atoms; a and b each are integer of 0 to 30, at least one of a and b is not 0, c and d each are 0 or 1) and has 500-3000 of number average molecular weight.