BGA PACKAGE USING LEAD FRAME TOGETHER WITH PCB FOR ENHANCING ELECTRICAL, THERMAL AND MECHANICAL PROPERTIES

PURPOSE: A BGA(Ball Grid Array) package is provided to improve electrical, thermal and mechanical properties by using a lead frame together with a PCB(Printed Circuit Board). CONSTITUTION: A BGA package includes a PCB, a lead frame, an IC(Integrated Circuit) chip, bonding wires, a molding resin, and...

Full description

Saved in:
Bibliographic Details
Main Author LIM, GWANG MAN
Format Patent
LanguageEnglish
Korean
Published 08.03.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A BGA(Ball Grid Array) package is provided to improve electrical, thermal and mechanical properties by using a lead frame together with a PCB(Printed Circuit Board). CONSTITUTION: A BGA package includes a PCB, a lead frame, an IC(Integrated Circuit) chip, bonding wires, a molding resin, and solder balls. The PCB(30) includes a bond land on the upper surface and ball lands on the lower surface. The lead frame(110) is connected with a portion of the PCB except the bond and ball lands. The lead frame is used as at least one selected from a group consisting of power/ground wiring, a heat dissipating path and an external substrate bonding medium. The IC chip(12) is attached on the PCB. The bonding wires(14) are used for connecting electrically the chip with the bond land and the lead frame. The molding resin(16) is used for encapsulating selectively the resultant structure. The solder balls(18) used as the external substrate bonding medium are formed on the ball lands.
Bibliography:Application Number: KR20030060252