POLYIMIDE METAL LAMINATE USED AS MATERIAL OF CHIP ON FILM(COF) IN TAPE AUTOMATED BONDING(TAB) TAPE PROCESS

PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimi...

Full description

Saved in:
Bibliographic Details
Main Authors FUKUDA KAZUYUKI, HAGA YASUHIKO, OHTSUBO EIJI, TAKAKI TOSHIHIKO
Format Patent
LanguageEnglish
Korean
Published 07.03.2005
Edition7
Subjects
Online AccessGet full text

Cover

Loading…
Abstract PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimide metal laminate contains one or more resin layer prepared from a silica dispersed polyimide composition. The silica dispersed polyimide composition is obtained by reacting alkoxysilane and/or its partially hydrolyzed polycondensate(A) with an amino-containing compound(B) in a polyimide solution and/or a polyamic acid solution under the presence of water, wherein the compound(B) has a functional group bonded to silica. The polyimide solution and/or polyamic acid solution is a solution containing polyimide copolymer and/or polyamic acid copolymer synthesized from two more diamine compounds and one more tetracarbonic dianhydride.
AbstractList PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimide metal laminate contains one or more resin layer prepared from a silica dispersed polyimide composition. The silica dispersed polyimide composition is obtained by reacting alkoxysilane and/or its partially hydrolyzed polycondensate(A) with an amino-containing compound(B) in a polyimide solution and/or a polyamic acid solution under the presence of water, wherein the compound(B) has a functional group bonded to silica. The polyimide solution and/or polyamic acid solution is a solution containing polyimide copolymer and/or polyamic acid copolymer synthesized from two more diamine compounds and one more tetracarbonic dianhydride.
Author TAKAKI TOSHIHIKO
OHTSUBO EIJI
FUKUDA KAZUYUKI
HAGA YASUHIKO
Author_xml – fullname: FUKUDA KAZUYUKI
– fullname: HAGA YASUHIKO
– fullname: OHTSUBO EIJI
– fullname: TAKAKI TOSHIHIKO
BookMark eNqNijsKwkAUALfQwt8dHtgkhRASJPVmP_pwf2Q3hVUIshYiSSDeHyN6AKthmFmTRT_0cUUezqorauQCtAhUgaIaDQ0CGi84UA96lhrnYiWwMzqwBiQqnTArU0ADgToBtAn2c3KorOFoTkmgVfptrrZMeL8ly3v3nOLuxw3ZSxHY-RDHoY3T2N1iH1_tpc6z7JhleV6UJS3-u94-tze_
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
Edition 7
ExternalDocumentID KR20050022377A
GroupedDBID EVB
ID FETCH-epo_espacenet_KR20050022377A3
IEDL.DBID EVB
IngestDate Fri Jul 19 11:25:34 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
Korean
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_KR20050022377A3
Notes Application Number: KR20040066972
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050307&DB=EPODOC&CC=KR&NR=20050022377A
ParticipantIDs epo_espacenet_KR20050022377A
PublicationCentury 2000
PublicationDate 20050307
PublicationDateYYYYMMDD 2005-03-07
PublicationDate_xml – month: 03
  year: 2005
  text: 20050307
  day: 07
PublicationDecade 2000
PublicationYear 2005
RelatedCompanies MITSUI CHEMICALS, INC
RelatedCompanies_xml – name: MITSUI CHEMICALS, INC
Score 2.581945
Snippet PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion...
SourceID epo
SourceType Open Access Repository
SubjectTerms CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
Title POLYIMIDE METAL LAMINATE USED AS MATERIAL OF CHIP ON FILM(COF) IN TAPE AUTOMATED BONDING(TAB) TAPE PROCESS
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050307&DB=EPODOC&locale=&CC=KR&NR=20050022377A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEG8QjfqmqPEDTRPNAg-L4DY2HojZ2k4m27qMYfCJ7IvEjzAiM_773gYoT7y1vebSr7vrtb1fEbrryGqqKokkht22Bg5KqIphJ4nFFFwPOVaUqVR-B-S4nf5Ifh4r4wr6XMfClDihPyU4IkhUDPKel_p6_n-IRcu3lYv76A2Kskcz6FFh7R0rxZoVqNFjHqecCIT0Br7g-ksa2CtJVfUdtAsbabWQB_ZiFHEp802jYh6hPQ_4zfJjVPnIauiArP9eq6F9Z3XlDcmV9C1O0LvH7VdQNpRhhwW6jW3dsVw9YHg0ZBTrQ-xAxreAwk1M-paHuYtNy3YahJtNbLk40D2GYU3yoibFBnep5T41At1oLmmezwnMySm6NVlA-iI0evI3RpOBv9lD6QxVZ9ksPUe4laSJFsah9KC15SiFyYjkVOuGrWmB7BZLF6i-jdPldvIVOiyxTItHWWodVfOv7_QarHQe3ZSD-wuf0YuX
link.rule.ids 230,309,783,888,25576,76882
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEG8QjfimqPEDtYlmgQciuI2NB2K2rnOTrV3GMPhE9kXiR4DIjP--twHKE29tr2naa6_Xa3u_Q-iuIympIidiM-y2VTBQQqUZdpK4mYLpIcWyPBGLcEAu61hD6Xkkj0roc-0LU-CE_hTgiCBRMch7VuzX8_9LLKP4W7m4j96gaPZoBj1DWFvHcr5mBUPvUY8bnAiE9Pq-wPwlDfSVqCjaDtqFQ7aaxzugL3rulzLfVCrmIdrzoL1pdoRKH7MqqpB17LUq2ndXT96QXEnf4hi9e9x5hc3GoNilgeZgR3NtpgUUDwfUwNoAu5DxbaBwExPL9jBn2LQdt0642cA2w4HmUQxrkuc1DaxzZtjsqR5oemNJ83xOYE5O0K1JA2I1odPjPx6N-_7mCMVTVJ7OpukZwq0kTdQwDsUHtS1FKUxGJKVqN2xNcmS3WDxHtW0tXWwn36CKFbjO2LFZ_xIdFLim-QctpYbK2dd3egUaO4uuC0b_AlTGjoc
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=POLYIMIDE+METAL+LAMINATE+USED+AS+MATERIAL+OF+CHIP+ON+FILM%28COF%29+IN+TAPE+AUTOMATED+BONDING%28TAB%29+TAPE+PROCESS&rft.inventor=FUKUDA+KAZUYUKI&rft.inventor=HAGA+YASUHIKO&rft.inventor=OHTSUBO+EIJI&rft.inventor=TAKAKI+TOSHIHIKO&rft.date=2005-03-07&rft.externalDBID=A&rft.externalDocID=KR20050022377A