POLYIMIDE METAL LAMINATE USED AS MATERIAL OF CHIP ON FILM(COF) IN TAPE AUTOMATED BONDING(TAB) TAPE PROCESS
PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimi...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
07.03.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Abstract | PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimide metal laminate contains one or more resin layer prepared from a silica dispersed polyimide composition. The silica dispersed polyimide composition is obtained by reacting alkoxysilane and/or its partially hydrolyzed polycondensate(A) with an amino-containing compound(B) in a polyimide solution and/or a polyamic acid solution under the presence of water, wherein the compound(B) has a functional group bonded to silica. The polyimide solution and/or polyamic acid solution is a solution containing polyimide copolymer and/or polyamic acid copolymer synthesized from two more diamine compounds and one more tetracarbonic dianhydride. |
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AbstractList | PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimide metal laminate contains one or more resin layer prepared from a silica dispersed polyimide composition. The silica dispersed polyimide composition is obtained by reacting alkoxysilane and/or its partially hydrolyzed polycondensate(A) with an amino-containing compound(B) in a polyimide solution and/or a polyamic acid solution under the presence of water, wherein the compound(B) has a functional group bonded to silica. The polyimide solution and/or polyamic acid solution is a solution containing polyimide copolymer and/or polyamic acid copolymer synthesized from two more diamine compounds and one more tetracarbonic dianhydride. |
Author | TAKAKI TOSHIHIKO OHTSUBO EIJI FUKUDA KAZUYUKI HAGA YASUHIKO |
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Snippet | PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion... |
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SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING |
Title | POLYIMIDE METAL LAMINATE USED AS MATERIAL OF CHIP ON FILM(COF) IN TAPE AUTOMATED BONDING(TAB) TAPE PROCESS |
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