POLYIMIDE METAL LAMINATE USED AS MATERIAL OF CHIP ON FILM(COF) IN TAPE AUTOMATED BONDING(TAB) TAPE PROCESS

PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimi...

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Bibliographic Details
Main Authors FUKUDA KAZUYUKI, HAGA YASUHIKO, OHTSUBO EIJI, TAKAKI TOSHIHIKO
Format Patent
LanguageEnglish
Korean
Published 07.03.2005
Edition7
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Summary:PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimide metal laminate contains one or more resin layer prepared from a silica dispersed polyimide composition. The silica dispersed polyimide composition is obtained by reacting alkoxysilane and/or its partially hydrolyzed polycondensate(A) with an amino-containing compound(B) in a polyimide solution and/or a polyamic acid solution under the presence of water, wherein the compound(B) has a functional group bonded to silica. The polyimide solution and/or polyamic acid solution is a solution containing polyimide copolymer and/or polyamic acid copolymer synthesized from two more diamine compounds and one more tetracarbonic dianhydride.
Bibliography:Application Number: KR20040066972