POLYIMIDE METAL LAMINATE USED AS MATERIAL OF CHIP ON FILM(COF) IN TAPE AUTOMATED BONDING(TAB) TAPE PROCESS
PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimi...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
07.03.2005
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PURPOSE: A polyimide metal laminate is provided to have a polyimide resin layer excelling in elastic modulus, transparency, dimensional stability, and adhesion to the inorganic compound substrate at high temperature, which is used as a material of COF in a TAB tape process. CONSTITUTION: The polyimide metal laminate contains one or more resin layer prepared from a silica dispersed polyimide composition. The silica dispersed polyimide composition is obtained by reacting alkoxysilane and/or its partially hydrolyzed polycondensate(A) with an amino-containing compound(B) in a polyimide solution and/or a polyamic acid solution under the presence of water, wherein the compound(B) has a functional group bonded to silica. The polyimide solution and/or polyamic acid solution is a solution containing polyimide copolymer and/or polyamic acid copolymer synthesized from two more diamine compounds and one more tetracarbonic dianhydride. |
---|---|
Bibliography: | Application Number: KR20040066972 |