PATTERNING METHOD OF ORGANIC OR ORGANIC/INORGANIC MATERIAL ON SUBSTRATE COMPRISING PATTERNING WATER-SOLUBLE MATERIAL ON SUBSTRATE, EVAPORATION DEPOSITING ORGANIC OR ORGANIC/INORGANIC MATERIAL ON THE FORMED SURFACE AND LIFTING OFF THE WATER-SOLUBLE MATERIAL IN AQUEOUS SOLUTION, ITS PATTERN, SUBSTRATE HAVING PATTERN, AND USE OF PATTERNED NANOPARTICLE FILM

PURPOSE: A method for patterning an organic or organic/inorganic material on a substrate suitable for a polymer or nanoparticle film evaporation deposited on an organic solvent or an organic molecule without the contact with a photoresist system solvent, a pattern of an organic or organic/inorganic...

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Bibliographic Details
Main Authors HARNACK OLIVER, VOSSMEYER TOBIAS, YASUDA AKIO, RAIBLE ISABELLE
Format Patent
LanguageEnglish
Korean
Published 07.03.2005
Edition7
Subjects
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Summary:PURPOSE: A method for patterning an organic or organic/inorganic material on a substrate suitable for a polymer or nanoparticle film evaporation deposited on an organic solvent or an organic molecule without the contact with a photoresist system solvent, a pattern of an organic or organic/inorganic material prepared by the method, a substrate having at least one pattern prepared by the method, and a patterned nanoparticle film's use. CONSTITUTION: The method comprises the steps of patterning a water-soluble material A on the surface of a substrate to form a substrate/material A surface; evaporation depositing an organic or organic/inorganic material B on the substrate/material A surface; and lifting off the material A in an aqueous solution. Preferably the substrate is a wafer; the water-soluble material A is selected from an inorganic material such as a metal oxide, ceramic, etc. and an organic material such as an organic polymer, an organic monomer, etc.; and the organic or organic/inorganic material B comprises a nanoparticle and an organic component.
Bibliography:Application Number: KR20040066721