ORGANIC SILICATE HIGH POLYMER COMPLEX WITH LOW DIELECTRIC PROPERTY SHOWING LOW DIELECTRIC COEFFICIENT

• Main Authors: OH, WEON TAE, LEE, BYEONG DU, REE, MOON HOR, HWANG, YONG TAEK
• Format: Patent
• Language: English; Korean
• Published: 04.03.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE: Provided is an organic silicate high polymer complex with low dielectric property which remarkably decreases dielectric coefficient of a thin film so that it is very useful in an insulated film of a semiconductor element. CONSTITUTION: The organic silicate high polymer complex with low dielectric property is characterized by including thermally-treated reaction products of an organic/inorganic complex high polymer which are produced by chemically combining an organic silicate high polymer with pore derivatives high polymer, in which radial pore derivatives high polymer with hydrolyzed alkoxysilyl group at terminal is located at the center of the organic/inorganic complex high polymer.