METHOD FOR BONDING ANODE BY USING CAP FOR PREVENTING SHORT CIRCUIT BY SHIELDING METAL FROM UPPER ELECTRODE

PURPOSE: A method for bonding an anode by using a cap is provided to prevent a short circuit from being generated while bonding the anode by shielding a contact between a metal and an upper electrode using a nonconductor cap. CONSTITUTION: A method for bonding an anode includes a step of separately...

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Bibliographic Details
Main Authors LEE, DAE SEONG, PARK, JUN SIK, SHIN, GYU SIK, PARK, HYO DEOK
Format Patent
LanguageEnglish
Korean
Published 17.12.2004
Edition7
Subjects
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:PURPOSE: A method for bonding an anode by using a cap is provided to prevent a short circuit from being generated while bonding the anode by shielding a contact between a metal and an upper electrode using a nonconductor cap. CONSTITUTION: A method for bonding an anode includes a step of separately forming a lower anode bonding layer(30), an upper anode bonding layer(31), and a cap(32). The lower anode bonding layer(30) includes a conductive plate having a predetermined thickness. The upper anode bonding layer(31) is formed by filling a metal into a hole after the hole is formed by etching one portion of a nonconductor forming the upper anode bonding layer(31). The cap(32) includes a plate made from an insulating material. The upper anode bonding layer(31) is stacked on the lower anode bonding layer(30), and the cap(32) is stacked on the upper anode bonding layer(31).
Bibliography:Application Number: KR20030037077