POLISHING AGENT SLURRY COMPRISING POLISHING MICROPARTICLE, COLLOIDAL OXIDE MICROPARTICLE AND DISPERSING MEDIUM, AND PREPARATION METHOD OF SUBSTRATE USING THE SLURRY

PURPOSE: Provided are a polishing agent slurry which is improved in dispersion stability for a long time, has a good re-dispersion and is free from an organic dispersant, and a method for preparing a substrate by using the slurry. CONSTITUTION: The polishing agent slurry comprises a polishing microp...

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Bibliographic Details
Main Authors CHO TOSHITSURA, ASO TOSHIAKI, IWASHIRO AKIRA
Format Patent
LanguageEnglish
Korean
Published 15.11.2004
Edition7
Subjects
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Summary:PURPOSE: Provided are a polishing agent slurry which is improved in dispersion stability for a long time, has a good re-dispersion and is free from an organic dispersant, and a method for preparing a substrate by using the slurry. CONSTITUTION: The polishing agent slurry comprises a polishing microparticle comprising at least one kind of oxide; a colloidal oxide microparticle having an average diameter smaller than that of the polishing microparticle; and a dispersing medium for dispersing the polishing microparticle and the colloidal oxide microparticle. Preferably the polishing microparticle has an average diameter (Dp) of 100-5,000 nm and the colloidal oxide microparticle has an average diameter (Dc) of 10-300 nm, and the ratio of Dp/Dc is 10 or less. Preferably the polishing microparticle is cerium oxide; the colloidal oxide microparticle is colloidal silica; and the dispersing medium is water or an aqueous dispersing medium mainly comprising water.
Bibliography:Application Number: KR20040007302