OPTICAL ASSEMBLY CAPABLE OF COMMUNICATING BETWEEN OPTICAL CHIPS

• Main Authors: PIERSON MARK V, SCHENFELD EUGEN
• Format: Patent
• Language: English; Korean
• Published: 09.11.2004
• Edition: 7
• Subjects: ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; TRANSMISSION

PURPOSE: An optical assembly having an optical cube is provided to receive or transmit electrical signals from or to the optical cube by optimizing a throughput of integrated circuits mounted on the optical cube. CONSTITUTION: An optical assembly(10) includes an optical cube(20), a first optical transmitter chip, a first optical receiver chip, a first continuous printed circuit board, a second optical transmitter chip, a second optical receiver chip, and a second continuous printed circuit board. The first optical transmitter chip(40a,44a) and the first optical receiver chip are mounted on one surface(42a) of the optical cube. The first continuous printed circuit board is soldered to electrical surfaces of the first optical transmitter chip and the first optical receiver chip opposite the optical cube. The second optical transmitter chip and the second optical receiver chip are mounted on an opposite surface of the optical cube. The second continuous printed circuit board is soldered to electrical surfaces of the second optical transmitter chip and the second optical receiver chip opposite the optical cube. The first optical transmitter chip is optically aligned with the second optical receiver chip through the optical cube and the second optical transmitter chip is optically aligned with the first optical receiver chip through the optical cube.