LEAD-FREE SOLDER ALLOY FOR PREVENTING WORKERS FROM BEING SUBJECT TO LEAD POISONING DUE TO LEAD CONTAINED IN A SOLDER ALLOY

PURPOSE: A lead-free solder alloy is provided to prevent workers from being subject to lead poisoning due to lead contained in a solder alloy by performing soldering work using the lead-free solder alloy. CONSTITUTION: A lead-free solder alloy includes 0.01 to 7.0 weight percent of Cu, 0.01 to 3.0 w...

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Bibliographic Details
Main Authors YOON, WON GYU, KIM, GWAN SU
Format Patent
LanguageEnglish
Korean
Published 22.10.2004
Edition7
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: A lead-free solder alloy is provided to prevent workers from being subject to lead poisoning due to lead contained in a solder alloy by performing soldering work using the lead-free solder alloy. CONSTITUTION: A lead-free solder alloy includes 0.01 to 7.0 weight percent of Cu, 0.01 to 3.0 weight percent of Ge, and Sn. Sn has no poisonous component and provides wetness to a base metal so that Sn is an essential metal for soldering work. Cu is added to a lead-free alloy in order to improve bonding strength while preventing electronic parts or a printed circuit board from being eroded. Instead of Ge, it is possible to use one selected from the group consisting of Ag, Ga, In or a mixture thereof. Ag allows a melted lead-free alloy to rapid diffused into the base metal, thereby improving bonding strength between the lead-free alloy and the base metal.
Bibliography:Application Number: KR20030024317