INTERCONNECTION BOARD AND CIRCUIT MODULE EXCLUDING SHIELD GAP

• Main Authors: TSUKAMOTO SOTARO, HANAI NOBUHIRO, HAYASHIDA MASATO, KUROMIYA SATORU
• Format: Patent
• Language: English; Korean
• Published: 21.10.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PURPOSE: An interconnection board and a circuit module is provided to eliminate a shield gap by shielding integrated circuits with shielding interconnection films and shielding interlayer connection conductor films. CONSTITUTION: An interconnection board includes an interlayer dielectric(12), a multilayer interconnection film(10), an interlayer-connection conductor film, at least one bare semiconductor integrated circuit device(16), first and second shield interconnection film, and a plurality of shield interlayer-connection conductor films. The multilayer interconnection film is arranged at one or between two interlayer dielectrics. Each of the interlayer-connection conductor films forms an electrical connection between at least two of the interlayer dielectrics. The first shield interconnection film is provided above the semiconductor IC and the second shield interconnection film is provided below the semiconductor IC. The shield interlayer-connection conductor films are provided so as to surround the semiconductor IC and to provide electrical connections between the first shield and second shield interconnection films. Each shield interlayer-connection conductor film extends through at least one of the interlayer dielectric.